| 摘要 |
A need exists in the art for a method of generating junction temperatures for multiple-chip packages that takes into account the non-linearity of thermal systems, improves accuracy, and allows more than one multiple-chip package to be measured without again determining the power distribution ratio of each device. To meet this need, the invention includes a method of generating junction temperatures in a multiple-chip package by heating a single chip in the multiple-chip package, measuring the change in temperature of each chip in the multiple-chip package, storing the measured temperature change of each chip, and repeating the heating, measuring, and storing steps for each chip in the multiple-chip package. The invention generates the junction temperatures of each chip in the multiple-chip package when each chip is operating simultaneously based on the stored measured temperature changes and accounting for a non-linearity in a thermal system of the multiple-chip package based on power dissipation ratios of each chip.
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