WIRING BOARD INCLUDING HIGH PRECISION CONDUCTIVE CIRCUIT PATTERN FORMED ON SUBSTRATE, APPARATUS FOR MANUFACTURING WIRING BOARD, AND METHOD FOR MANUFACTURING WIRING BOARD

摘要

PURPOSE: A wiring board, an apparatus, and a method are provided to form a high precision conductive circuit pattern and a conductive layer of a conductive circuit pattern on a substrate. CONSTITUTION: A wiring board(10) comprises a base(11) serving as a substrate where a visible image is transferred; a non-conductive metal-containing resin layer(12) selectively formed on the substrate, wherein the non-conductive metal-containing resin layer contains metal particulates dispersed in the metal-containing resin layer; a conductive conductor metal layer(13) formed on the metal-containing resin layer; and a resin layer(14) formed between the metal-containing resin layers on the substrate.