| 摘要 |
PURPOSE: A radiation-sensitive resin composition useful as a chemically amplified resist having high transmittance of radiation and exhibiting superior basic properties as a resist such as high sensitivity, resolution, dry etching tolerance, and pattern shape is provided. CONSTITUTION: The radiation-sensitive resin composition comprises (A) an acid-dissociable group-containing resin which is insoluble or scarcely soluble in alkali and becomes alkali soluble when the acid-dissociable group dissociates, the resin comprising the recurring unit of the following formula(1) and the recurring unit of the following formula(2), wherein R1 and R2 individually represent a hydrogen atom or methyl group, R3 represents a hydrogen atom or methyl group, and R4 individually represents a linear or branched alkyl group having 1 to 4 carbon atoms or a monovalent alicyclic hydrocarbon group having 4 to 20 carbon atoms or a derivative thereof, or any two of R4 groups from in combination a divalent alicyclic hydrocarbon group having 4 to 20 carbon atoms or a derivative thereof, with the remaining R4 group being a linear or branched alkyl group having 1 to 4 carbon atoms or a monovalent alicyclic hydrocarbon group having 4 to 20 carbon atoms or a derivative thereof, and (B) a photoacid generator of the following formula(3), wherein R5 represents a monovalent aromatic hydrocarbon group having 6 to 20 carbon atoms or a derivative thereof, m is an integer of 1 to 8, and n is an integer of 0 to 5.
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