| 摘要 |
PURPOSE: An ejecting device for fabricating a semiconductor package is provided to reduce the allocated space for an ejecting device by arranging all components of the ejecting device in a moving plate of the auto-molding system. CONSTITUTION: An ejecting device includes an ejector pin/plate, an ejector bar(12) and an eject block(11). The eject bar is movably formed in a plate space on a moving plate. And the eject bar is upwardly moved by contacting with the eject block formed at the bottom side. Two guide pins(13) is vertically attached at a margin of opposite both sides of the plate space.
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