发明名称 Method and device for drying flat objects, in particular gallium or silicon wafers or other like substrates
摘要 In a method of drying flat objects such as plate-shaped data storage media or semi-finished products thereof, in particular slices of gallium or silicon or like substrates, in a closable process chamber (30, 61) for receiving a carrier (12) that holds the substrate(s) (10), the substrates (10) are dipped into a bath (20) and can be moved within the spraying region of nozzles (50, 51, 52); the slice(s) (10) or the like is/are dipped into the bath (20) consisting of high-purity treatment liquid as separation medium (Q) and specifically lighter water, and a transverse current is generated by the separation medium at the bath surface (21) and the residual moisture is pushed off the bath surface. Moreover, the treatment liquid or the separation medium (Q) is cooled at room temperature; the temperature of the slice (10) or the like is kept above the ambient temperature, in particular about 5° C. above room temperature.
申请公布号 US2005022418(A1) 申请公布日期 2005.02.03
申请号 US20040494454 申请日期 2004.09.02
申请人 RIETMANN WERNER 发明人 RIETMANN WERNER
分类号 H01L21/00;(IPC1-7):F26B3/00 主分类号 H01L21/00
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