| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and device satisfactorily removing the burrs left on the external surface of a board. SOLUTION: The method for removing the burrs left on the side of the wiring board 10 comprises the steps of inputting the board 10 and a number of silica particle 30 having a grain size of about 1 to 10 [μm] in a tray 110, and vibrating the tray 110 with the board 10 and the particle 30 entered in vertical, horizontal, and height directions. This can contact the burr of the side of the board 10 with the particle 30 to scrape and satisfactorily remove the burr. COPYRIGHT: (C)2005,JPO&NCIPI
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