发明名称 |
Zone polishing using variable slurry solid content |
摘要 |
A slurry dispensing apparatus for use with a chemical mechanical polishing tool for planarizing semiconductor substrates having irregular topology. The apparatus includes a slurry dispensing manifold with a first end suspended over a polishing pad, and a second end for mounting to the chemical mechanical polishing tool. The slurry dispensing manifold has a linear array of nozzles positioned under the suspended manifold. Each nozzle provides an adjusted slurry mixture that is supplied from bifurcated supply lines. A first branch supplying a slurry, and a second branch supplying deionized water. Each nozzle is capable of providing a particular slurry concentration to either decrease or to increase polishing rate in specific zonal areas on a substrate according to its surface topology.
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申请公布号 |
US2005026549(A1) |
申请公布日期 |
2005.02.03 |
申请号 |
US20030633131 |
申请日期 |
2003.08.01 |
申请人 |
CHARTERED SEMICONDUCTOR MANUFACTURING LTD. |
发明人 |
MAURY ALVARO;LIM JOVIN;LAYADI NACE;QUEK SEBASTIAN |
分类号 |
B24B37/04;B24B57/02;(IPC1-7):B24B49/00;B24B51/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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