| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive tape which prevents transfer of an adhesive layer to a dicing frame used repeatedly for securing a wafer when dicing and can be manufactured at low costs. SOLUTION: This adhesive tape has an intermediate resin layer, the adhesive power of which changes through exposure to radiation or heat treatment, between a base film and an adhesive layer. An adherend is bonded to the adhesive layer. When assuming that the peeling power between the intermediate resin layer and the adhesive layer is A and that between the adherend and the adhesive layer is B, B is greater than A before the treatment, and A is greater than B after the treatment. COPYRIGHT: (C)2005,JPO&NCIPI |
