| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus that can precisely measure the solder wettability of a surface-mounting component or the like which has been miniaturized to cope with the miniaturization of electronic/electric products. SOLUTION: A resist film 15 is formed on the upper face of a test jig plate 4 so that solder paste 3, which is printed or applied on the inside of the resist-film pattern 15, can form a sphere without spreading out by wetting when the solder paste is melted. The solder paste 3 is heated to form a melted sphere, and a mounting component 1 is touched to the small solder sphere. The force required to move the mounting component upward by a chuck 2 is detected to find the solder wettability of the mounting component 1. In forming the resist film 15 so that the melted solder may not arbitrarily spread out, the resist film 15 is applied on the outside of a circle located at the center of the test jig plate 4, wherein the diameter of the circle is arbitrarily determined such as 1 mm, 2 mm, or 4 mm, depending on the size of the mounting component to be measured. The quantity of the solder paste 3, which is printed or applied, is determined by considering the size of the melted sphere. COPYRIGHT: (C)2005,JPO&NCIPI
|
