A method for providing an encapsulated optoelectronic chip is provided. The optoelectronic chip is secured on a substrate. A translucent coating substance is then applied on said optoelectronic chip and the translucent coating substance is then polished away to enable an optical coupling.
申请公布号
WO2005010580(A1)
申请公布日期
2005.02.03
申请号
WO2004CA01408
申请日期
2004.07.26
申请人
REFLEX PHOTONIQUE INC./REFLEX PHOTONICS INC.;ROLSTON, DAVID ROBERT CAMERON;MAJ, TOMASZ;FU, SHAO-WEI
发明人
ROLSTON, DAVID ROBERT CAMERON;MAJ, TOMASZ;FU, SHAO-WEI
