| 摘要 |
PROBLEM TO BE SOLVED: To provide a mold for molding a resin constituted so as to make the clamping pressure to a substrate proper and uniform even if the substrate is made large-sized and the irregularity of thickness or the like occurs in the substrate, and a resin molding method. SOLUTION: The lower mold 1 of the mold for molding the resin is provided with an underside holder 3, two underside blocks 4 placed on the underside holder 3, the pot block 5 fitted in the through-hole of the underside holder 3 and the space between the underside blocks 4 and the pressure sensors 8 arranged between the underside holder 3 and the underside blocks 4. An upper side holder 11, the piezoelectric element 20 fixed to the recessed part 18 of the upper side holder 11 and the cavity block 12 fixed to the under surface of the piezoelectric element 20 are provided to the upper mold 2 opposed to the lower mold 1. The clamping forces applied to respective substrates 10L and 10R are detected by the pressure sensors 8. When the clamping pressures are less than a target value, voltage is applied to the piezoelectric element 20 to protrude an end surface and the back surface of the cavity block 12 is pressed by the end surface to set the clamping pressures to the target value. COPYRIGHT: (C)2005,JPO&NCIPI
|
