| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface acoustic wave device and manufacturing method thereof which secure leading flexibility in re-wiring without providing a printed board and which can easily structure a vibration space in a surface acoustic wave device of a wafer level CSP (Chip Size Package) structure where a hollow close space is provided around an excitation function portion. SOLUTION: A surface acoustic wave filter having an excitation function portion 22 and a pad electrode 23 is formed on one of the main surface of a piezoelectric substrate 21. A surface acoustic wave device is provided with a first insulation layer 24 formed on a region except a pad electrode portion 23, a wiring pattern 25 with electronic continuity which includes the pad electrode 23 and which is formed on the first insulation layer 24, a second insulation layer 26 formed on the wiring pattern 25, an external electrode 27 formed on the second insulation layer 26, and a column electrode 28 connecting the wiring pattern 25 buried in the second insulation layer 26 and the external electrode 27 so as to have an electronic continuity. COPYRIGHT: (C)2005,JPO&NCIPI
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