发明名称 LAID DOUBLE FLOOR STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a double floor structure for wiring and piping electric cables, communication lines, heating wires, and thermal pipes on an existing floor, or forming a space for passing cables and ventilating between the existing floor and a floor for living to pass hot air therethrough. SOLUTION: The bottom parts of a plurality of rectangular pallalelepiped are integrally connected to each other without clearance by using soft plates thinner than the rectangular pallalelepiped. Grooves for wiring are formed of the side faces of the rectangular pallalelepiped and the soft plates. A plurality of double floor units connected to each other through the soft plates are arranged on the floor in order. The peripheral parts of the double units are fitted and connected to each other with connection pins to form the double structure. Groove covers are put on the groove part to form the floor for living on the existing floor. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005030177(A) 申请公布日期 2005.02.03
申请号 JP20030293223 申请日期 2003.07.09
申请人 OOEI FLOOR SERVICE KK 发明人 SUGAYA AKIRA
分类号 E04F15/024;(IPC1-7):E04F15/024 主分类号 E04F15/024
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