FLEXIBLE PRINTED CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING THE SAME TO PREVENT FLEXIBLE PRINTED CIRCUIT BOARD FROM BEING WARPED

摘要

PURPOSE: A flexible printed circuit board is provided to prevent a flexible printed circuit board from being warped by attaching a metal stiffener and a polyimide stiffener to a portion of a flexible printed circuit board to which a semiconductor die and a connector are connected except a bent portion of the flexible printed circuit board. CONSTITUTION: An insulation layer includes the first, second and third regions(121,122,123). The first region is of a quadrilateral plate type, having a predetermined area. The second region is of a rectangular plate type having a predetermined area, connected to the first region. The third region is of a quadrilateral plate type having a predetermined area, connected to the second region. A plurality of conductive interconnection patterns(125) are formed on and under the insulation layer. A coverlay tape(126) of a predetermined thickness is formed on and under the insulation layer, covering the plurality of conductive interconnection patterns. A metal stiffener of a predetermined thickness is attached to a cover coat as a lower surface of the first region of the insulation layer. A polyimide stiffener(129) of a predetermined thickness is attached to a coverlay tape as an upper surface of the third region of the insulation layer.