发明名称 MULTICHANNEL TRANSMISSION LINE SUBSTRATE AND HIGH SPEED OPTICAL COMMUNICATION MODULE EMPLOYING IT
摘要 <P>PROBLEM TO BE SOLVED: To provide a high speed, high frequency multichannel transmission line substrate which can be reduced in size, and to realize a high speed optical communication module employing it. <P>SOLUTION: The multichannel transmission line substrate is provided, between a first dielectric layer 21 and a second dielectric layer 22, with transmission lines from a transmission line 1a for transmitting a first data signal through a transmission line 4a for transmitting a 32th data signal. The multichannel transmission line substrate is provided, between a second dielectric layer 22 and a third dielectric layer 23, with transmission lines from a transmission line 1b for transmitting a first data signal of reverse phase to that of the transmission line 1a through a transmission line 4b for transmitting a 32th data signal of reverse phase to that of the transmission line 4a. A first ground conductor 31 is provided on the backside of the first dielectric layer 21 and a second ground conductor 32 is provided on the third dielectric layer 23. They are used entirely as ground. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005033552(A) 申请公布日期 2005.02.03
申请号 JP20030196648 申请日期 2003.07.14
申请人 TOSHIBA CORP 发明人 TANIKOSHI SADAO
分类号 H01P1/04;H01P3/02;H01P3/08;H04B10/40;H04B10/50;H04B10/524;H04B10/60 主分类号 H01P1/04
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