| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating method by which a via or a wiring groove having an opening width of several tensμm and an aspect ratio of≥1.5 can be built in. SOLUTION: In the plating method, a conductive layer is formed at least on a part of a substrate in which a circuit pattern with a rugged shape is formed, a cathode potential is applied to the conductive layer, and a plating liquid being electrically in contact with an anode is fed to the conductive layer, so that the rugged-shaped pattern on the conductive layer is built in a plating film. As the plating liquid, the one comprising copper ions, organic acid or inorganic acid, chloride ions, a high molecular surfactant suppressing electrodeposition, a sulfur based saturated organic compound promoting the growth of the plating and a nitrogen-containing high molecular polymer flattening the growth of the plating is used. COPYRIGHT: (C)2005,JPO&NCIPI
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