INSPECTION METHOD FOR SEMICONDUCTOR DEVICE REDUCING STRESS APPLIED TO PHOTORESIST BY MEASURING AUTOMATICALLY ALTERNATE AREA NEAR BY

摘要

PURPOSE: An inspection method for semiconductor device is provided to reduce stress applied to a photoresist by measuring automatically an alternate area adjacent to an original measurement area. CONSTITUTION: A measuring position of a semiconductor substrate that a same-shaped unit pattern is repeatedly formed thereon is decided(S105). A first measuring position is detected and measured(S110). If the first measuring position is not detected or measured(S115), a first adjacent area adjacent to the first measuring position is detected(S120). The first adjacent area is measured(S125). A second measuring position is detected and measured(S130). If the second measuring position is not detected or measured(135), a second adjacent area adjacent to the second measuring position is detected(S140). The second adjacent area is measured(S145).