发明名称 |
Method and apparatus for testing semiconductor wafers |
摘要 |
A wafer testing apparatus comprises a sample chuck having a flat surface for supporting a test wafer positioned thereon, the sample chuck having a base structure manufactured of a conductive metal and having a semiconductor layer secured to the base structure defining the flat surface of the sample chuck, an electrical test probe establishing a correction factor corresponding to a location on the semiconductor layer surface to be used to report an electrical property at a location on a test wafer substantially unaffected by the electrical properties of the semiconductor layer and base structure below that location.
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申请公布号 |
US6851096(B2) |
申请公布日期 |
2005.02.01 |
申请号 |
US20020215383 |
申请日期 |
2002.08.08 |
申请人 |
SOLID STATE MEASUREMENTS, INC. |
发明人 |
ALEXANDER WILLIAM J. |
分类号 |
G01R31/26;G01R31/28;H01J61/16;H01J61/20;H01J61/33;H01J61/88;H01L21/66;H01L21/68;(IPC1-7):G06F17/50;G01R31/00 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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