ELECTRICAL CONNECTING ELEMENT AND METHOD OF PRODUCING THE SAME

摘要

A metallic thin film 15 is formed on a mold 11 having protrusions 12 complementary in shape to a conductor pattern to be formed; a substrate 17 having a transfer layer 16 of adherent (or adhesive) material applied to one side surface thereof is provided; and the transfer layer 16 side of the substrate is brought into intimate contact with the metallic thin film 15 laid over th e protrusions 12, followed by pulling the transfer layer apart from the mold s o as to transfer the metallic thin film 15 covering the protrusions 12 onto th e transfer layer 16 to thereby form the conductor pattern 18 on the transfer layer 16.