发明名称 |
Polishing pad for semiconductor wafer and polishing process using thereof |
摘要 |
An object of the present invention is to provide a polishing pad for a semiconductor wafer which can perform a stable polishing while preventing a polishing layer from floating up from a supporting layer and a surface of a polishing pad from bending during polishing using a polishing pad having a multi-layered structure of a polishing layer and a supporting layer, and a polishing process using thereof. The polishing pad of the present invention is characterized in that it is comprising a supporting layer which is a non-porous elastic body and a polishing layer which is laminated on one surface of the supporting layer, and a polishing process using thereof. Shore D hardness of the polishing layer is preferably 35 or more, and hardness of the supporting layer is preferably lower than that of the polishing layer. |
申请公布号 |
US6848974(B2) |
申请公布日期 |
2005.02.01 |
申请号 |
US20020252696 |
申请日期 |
2002.09.24 |
申请人 |
JSR CORPORATION |
发明人 |
HASEGAWA KOU;HOSAKA YUKIO |
分类号 |
B24B37/00;B24B37/04;B24B37/20;B24B37/22;B24B37/24;B24D13/12;B24D13/14;H01L21/304;H01L21/306;(IPC1-7):B24B1/00 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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