发明名称 Management system for automated wire bonding process
摘要 An integrated management system is provided for automatically executing a procedure of reviewing and editing an assembly reference and a bonding specification used for manufacturing IC packages. The system includes a drawing management system (DMS) that creates the assembly reference, and a bonding specification drawing system that creates, based on the assembly reference, the bonding specification. The integrated management system further includes a DMS database server that stores and manages the assembly reference and the bonding specification, a DMS file server that manages a blank diagram, a package outline, a bonding diagram, and a standard file, and a DMS web server that provides a web interface to a user for permitting a remote access. In particular, the drawing management system has a bonding rule check module that verifies whether the bonding specification meets a bonding rule suitable for an automated wire bonding process. The drawing management system produces the standard file to be transmitted to bonding equipments.
申请公布号 US6851100(B1) 申请公布日期 2005.02.01
申请号 US20030387354 申请日期 2003.03.11
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 YOU YEAN-SANG;KIM HEUI-SEOG;CHAE SOO-TAE
分类号 H01L21/50;G06F17/50;H01L21/52;(IPC1-7):G06F17/50 主分类号 H01L21/50
代理机构 代理人
主权项
地址