发明名称 METHOD OF MANUFACTURING END POINT CMP PAD FOR CHECKING EFFECTIVELY GROOVE STATE BY POSITIONING PADS WITH DIFFERENT COLOR ACCORDING TO EACH DEPTH
摘要 PURPOSE: A method of manufacturing an end point CMP(Chemical Mechanical Polishing) pad is provided to check effectively a state of a groove in a pad by applying various colors to the pad according to the depth of the groove. CONSTITUTION: A second etching stop pad(23), a first etching stop pad(25) and an upper pad(27) are sequentially formed on a lower pad(21). At this time, the pads have different colors. A plurality of grooves(29) for exposing the first etching stop pad to the outside are formed in the upper pad. The exposed first etching stop pad is removed until the second etching stop pad is selectively exposed. The upper pad is removed by using CMP(Chemical Mechanical Polishing).
申请公布号 KR20050011465(A) 申请公布日期 2005.01.29
申请号 KR20030050581 申请日期 2003.07.23
申请人 MAGNACHIP SEMICONDUCTOR, LTD. 发明人 JEONG, JONG YEUL
分类号 H01L21/304;(IPC1-7):H01L21/304 主分类号 H01L21/304
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