| 发明名称 |
FLUX FOR JOINING UNLEADED SOLDER, AND SOLDER PASTE |
| 摘要 |
PROBLEM TO BE SOLVED: To provide flux for joining unleaded solder, and solder paste. SOLUTION: The flux for joining unleaded solder contains carotinoid compound. The solder paste contains this flux for joining unleaded solder and a tin-zinc alloy solder powder. COPYRIGHT: (C)2005,JPO&NCIPI
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| 申请公布号 |
JP2005021973(A) |
申请公布日期 |
2005.01.27 |
| 申请号 |
JP20030270689 |
申请日期 |
2003.07.03 |
| 申请人 |
HUMAN UNITEC CO LTD |
发明人 |
SHIMAMURA ISAO;TEJIMA KOICHI |
| 分类号 |
B23K35/363;(IPC1-7):B23K35/363 |
主分类号 |
B23K35/363 |
| 代理机构 |
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代理人 |
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