发明名称 |
Semiconductor package having semiconductor constructing body and method of manufacturing the same |
摘要 |
A semiconductor package includes at least one semiconductor constructing body which has a semiconductor substrate and a plurality of external connection electrodes formed thereon. An insulating film covers the semiconductor constructing body. Each of interconnections which has a projecting electrode is formed on the insulating film. The projecting electrodes of the interconnection cut through the insulating film at portions corresponding to the external connection electrodes and electrically connected to the external connection electrodes. |
申请公布号 |
US2005019982(A1) |
申请公布日期 |
2005.01.27 |
申请号 |
US20040851880 |
申请日期 |
2004.05.20 |
申请人 |
CASIO COMPUTER CO., LTD. |
发明人 |
WAKABAYASHI TAKESHI;WAKISAKA SHINJI |
分类号 |
H01L23/52;H01L21/3205;H01L21/56;H01L23/12;H01L23/31;H01L23/48;H01L23/538;(IPC1-7):H01L21/50 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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