发明名称 SOLID-STATE IMAGING DEVICE AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a solid-state imaging device in which a vent hole to an internal space of a housing integrally molded by a resin can be easily formed by a simple constitution. <P>SOLUTION: The solid-state imaging device includes the housing 1 having a resin molded base plate 2 and rib 3, metal lead pieces 9 embedded in the housing and each having an internal terminal 9a facing the inner space 4 of the housing, an external terminal 9b exposed at the bottom surface of the housing, and a side face electrode 9c exposed at the outside face of the housing, an imaging element 5 fixed on the base plate in the inner space, metal fine wires 10 for connecting the electrodes of the imaging element to the internal terminal, and a transparent plate 7 fixed to the upper surface of the rib. A die pad 11 having a through hole 12 is embedded in the central part of the base plate so that upper and lower surfaces of the die pad 11 are exposed, and the imaging element is fixed on the die pad. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005026426(A) 申请公布日期 2005.01.27
申请号 JP20030189776 申请日期 2003.07.01
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NANO MASANORI;YAMAUCHI KOICHI;NISHIYAMA KENICHI;ITOI SEIICHI
分类号 H01L27/14;H01L23/02;H01L23/08;H01L31/02;H01L31/0203;H04N5/335;H04N5/372 主分类号 H01L27/14
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