| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To increase the connection reliability between lead electrodes and a chip component in a substrate wherein the prescribed chip component is mounted in a mounting section by thermal compression bonding via an adhesive material. <P>SOLUTION: In the substrate, the chip component 30 is mounted by thermal compression bonding via the adhesive material in the mounting section MA wherein the lead electrodes 121 are exposed, ribs 40 for regulating the flow direction of the adhesive material at the time of mounting the chip component 30 are formed in the mounting MA to prevent the air bubbles contained in the adhesive material from moving to the lead 121 side. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
