发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device by which blocking of dopant injection to a semiconductor substrate by a natural oxide film resulting from the atmospheric natural oxidation of unstable semiconductor atoms in amorphous sections on the surface layer of the semiconductor substrate can be prevented or suppressed, and the injection efficiency of dopant to the semiconductor substrate can be improved. SOLUTION: The method for manufacturing a semiconductor device is used to form a source/drain extension part in a semiconductor substrate. While the atmospheric pressure is being reduced, the surface layer of the semiconductor substrate is made amorphous by preamorphous injection (S2), and a dopant is injected to the amorphous part 1f (S3) to form the source/drain extension part in the surface layer of the semiconductor substrate. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005026442(A) 申请公布日期 2005.01.27
申请号 JP20030190091 申请日期 2003.07.02
申请人 RENESAS TECHNOLOGY CORP 发明人 KAWASAKI YOJI
分类号 H01L21/265;H01L21/336;H01L29/78;(IPC1-7):H01L21/265 主分类号 H01L21/265
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