发明名称 |
Apparatus for planarizing microelectronic workpieces |
摘要 |
Planarizing machines and methods for accurately planarizing microelectronic workpieces. Several embodiments of the planarizing machines produce a planar surface at a desired endpoint in the microelectronic workpieces by (a) quickly reducing variances on the surface of the workpiece using a planarizing medium that removes topographical features but has a low polishing rate on planar surfaces; and (b) subsequently planarizing the wafer on a planarizing medium that has a higher polishing rate on planar surfaces than the first polishing medium.
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申请公布号 |
US2005020191(A1) |
申请公布日期 |
2005.01.27 |
申请号 |
US20040922027 |
申请日期 |
2004.08.19 |
申请人 |
TAYLOR THEODORE M. |
发明人 |
TAYLOR THEODORE M. |
分类号 |
B24B37/04;(IPC1-7):B24B49/00;B24B51/00;B24B1/00;B24B7/19 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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