| 摘要 |
A semiconductor inspection system (100) comprises a first inspection tool (108A) communicatively coupled to a network (104), a second inspection tool (108B) communicatively coupled to the network, and a multi-tool manager (102) communicatively coupled to the network. The multi-tool manager is configured to monitor the first inspection tool and the second inspection tool through the network. The inspection tool (300) includes a robot (304), a first wafer carrier (312) proximate the robot, a first wafer inspection module (320) proximate the robot, a second wafer inspection module (318) proximate the robot, and a controller (308) configured for controlling the robot to pass wafers between the first wafer carrier, the first wafer inspection module, and the second wafer inspection module. |
