| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive paper-base laminated phenolic resin board that can reduce refuses by reutilizing the cutting dust, end material, etc., of the board which are conventionally disposed as refuses, and to provide an electronic component using the board. SOLUTION: The laminated phenolic resin board is manufactured by laminating prepregs obtained by impregnating a phenolic resin composition into paper-base materials and drying the composition upon another and heating and pressurizing the laminate. A filler is contained in the prepregs. The filler is a reproduced material produced by pulverizing the paper-base phenolic resin board. The content of the pulverized reproduced material with respect to the phenolic resin component is adjusted to 5-50 wt%. COPYRIGHT: (C)2005,JPO&NCIPI |
