| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal-ceramic bonded circuit board which is capable of restraining a terminal connection from rising up or ultrasonic energy from diverging in a wire bonding operation, relaxing thermal stress much more, and restraining a metal circuit board from being separated from a ceramic board as much as possible even when excessive stress is induced, and to provide its manufacturing method. SOLUTION: The metal circuit board is bonded on, at least, the one surface of the ceramic board to form a ceramic circuit board, and the terminal connection of the metal circuit board nearly corresponding to a region where terminals are connected to the metal circuit board is bonded to the ceramic board by a bonding strength lower than that applied to a part of the metal circuit board other than the terminal connection of the metal circuit board. COPYRIGHT: (C)2005,JPO&NCIPI
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