发明名称 |
Methods for enclosing a thermoplastic package |
摘要 |
A circuit package for housing semiconductor or other integrated circuit devices ("die") includes a high-copper flange, one or more high-copper leads and a liquid crystal polymer frame molded to the flange and the leads. A lid is welded to the frame after a die is attached to the flange.
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申请公布号 |
US2005016750(A1) |
申请公布日期 |
2005.01.27 |
申请号 |
US20040920643 |
申请日期 |
2004.08.18 |
申请人 |
QUANTUM LEAP PACKAGING, INC. |
发明人 |
ZIMMERMAN MICHAEL |
分类号 |
H01L23/047;H01L23/10;H01L23/492;H01L23/498;(IPC1-7):H05K5/06 |
主分类号 |
H01L23/047 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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