发明名称 |
SPUTTERING TARGET ASSEMBLY HAVING LOW CONDUCTIVITY BACKING PLATE AND METHOD OF MAKING SAME |
摘要 |
A target and backing plate assembly and method of making the same. The backing plate is made of a material having an electrical conductivity less than or equal to 45 % IACS and is selected from the group consisting of Al alloys, Cu alloys, magnesium, magnesium alloys, molybdenum, molybdenum alloys, zinc, zinc alloys, nickel and nickel alloys. |
申请公布号 |
WO2005007920(A2) |
申请公布日期 |
2005.01.27 |
申请号 |
WO2004US22615 |
申请日期 |
2004.07.13 |
申请人 |
TOSOH SMD, INC.;BAILEY, ROBERT, S.;HOLCOMB, MELVIN, K. |
发明人 |
BAILEY, ROBERT, S.;HOLCOMB, MELVIN, K. |
分类号 |
B21D39/03;C23C;C23C14/34 |
主分类号 |
B21D39/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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