发明名称 HEAT-CURABLE COMPOSITIONS COMPRISING LOW-TEMPERATURE IMPACT STRENGTH MODIFIERS
摘要 The invention relates to compositions containing at least one epoxide adduct A that comprises an average of more than one epoxide group per molecule, at least one polymer B of formula (I), at least one thixotropic agent C based o n a urea derivative in a non-diffusing carrier material, and at least one hardener D for epoxy resins, which is activated at an increased temperature. Said composition is used particularly as an adhesive and is provided with exceptionally high impact peel characteristics, especially at low temperatures. The invention further relates to epoxide group-terminal impact strength modifiers of formula (I), which significantly increase the impact resistance in epoxy resin compositions, particularly two-component epoxy res in compositions.
申请公布号 CA2532215(A1) 申请公布日期 2005.01.27
申请号 CA20042532215 申请日期 2004.07.16
申请人 SIKA TECHNOLOGY AG 发明人 FINTER, JUERGEN;KRAMER, ANDREAS;GERBER, ULRICH
分类号 C08G18/10;C07D303/24;C08G18/28;C08G18/48;C08G18/73;C08G59/22;C08G59/28;C08G59/32;C09J175/04 主分类号 C08G18/10
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