ELECTRONIC-PART MOUNTING STRUCTURE, METHOD FOR MOUNTING ELECTRONIC PART AND ADHESIVE FOR ELECTRONIC PART

摘要

PROBLEM TO BE SOLVED: To provide an electronic-part mounting structure and a method for mounting an electronic part, by which excellent thermal fatigue characteristics can be ensured, and an adhesive for the electronic part used in the mounting method.

SOLUTION: The electronic-part mounting structure has a constitution in which a resin for a reinforcement is formed between the bump-forming surface of the electronic part and the electrode-forming surface of a substrate. A substance having a resin material-quality having the characteristics of a softening by a heating is used as the adhesive for the electronic part used for a resin. The adhesive power of the resin defined by a shear strength at a time when a rectangular chip having a 1608 size is bonded on an aluminum plate with a resin is 10 N or more at a normal temperature and is 5 N or less at 70°C. Accordingly, a stress generated in a solder bump by the thermal expansion of the resin section in the case of a high temperature is lowered, and the excellent thermal-fatigue characteristics of the solder bump can be ensured.

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