| 摘要 |
PROBLEM TO BE SOLVED: To enable bundling one ends of a plurality of conductive materials into one location for connecting with other conductive materials, or for connecting between separated conductive materials, using an inexpensive and simple structure. SOLUTION: The contact mechanism 30 comprises two tension springs 31 and a joint member 32. Hooks 31c are provided on one ends of the tension springs 31 and contact parts 31d are provided on the other ends. A ring 32c is provided on one end of the joint member 32 and a ground is connected to the other end through an enclosure of a printer 1. The contact parts 31d of the tension springs 31 are arranged to abut conductive bearings 4a, 5a, of rollers 4, 5, and the hooks 31c of the tension springs 31 are bundled by a ring 32c of the joint member 32 into one location. COPYRIGHT: (C)2005,JPO&NCIPI
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