发明名称 |
Process for fabricating a semiconductor package and semiconductor package with leadframe |
摘要 |
A semiconductor package includes a flat metal leadframe including spaced apart portions, at least some of which constitute electrical connection leads. A filling material fills the spaces that separate the spaced apart portions of the leadframe to form a plate before fastening an integrated circuit chip to the front of the leadframe. Electrical connections are made between the chip and the electrical connection leads. The chip is then encapsulated on the front of the leadframe using a formed or attached encapsulant.
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申请公布号 |
US2005017330(A1) |
申请公布日期 |
2005.01.27 |
申请号 |
US20040827612 |
申请日期 |
2004.04.19 |
申请人 |
STMICROELECTRONICS S.A. |
发明人 |
DIOT JEAN-LUC;TEYSSEYRE JEROME |
分类号 |
H01L21/56;H01L23/498;(IPC1-7):H01L23/495;H01L21/50 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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