发明名称 |
Method of forming redistribution bump and semiconductor chip and mount structure fabricated using the same |
摘要 |
Provided are a method of forming a bump whose upper surface is substantially flat and whose area can be enlarged in a uniform pad pitch to simplify mounting a liquid crystal display drive IC (LDI) and a semiconductor chip and a mount structure using the method to minimize a pad area inside the chip. Thus, the pad area on an edge of a conventional chip is minimized and the bump is formed in a substantially flat location inside the chip and an electrical connection between the pad and the bump is performed by a redistribution metal line.
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申请公布号 |
US2005017343(A1) |
申请公布日期 |
2005.01.27 |
申请号 |
US20040898445 |
申请日期 |
2004.07.22 |
申请人 |
KWON YONG-HWAN;KANG SA-YOON;LEE CHUNG-SUN |
发明人 |
KWON YONG-HWAN;KANG SA-YOON;LEE CHUNG-SUN |
分类号 |
H01L21/44;H01L21/60;H01L23/31;H01L23/485;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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