摘要 |
PROBLEM TO BE SOLVED: To provide flux for joining unleaded solder, and solder paste. SOLUTION: The flux for joining unleaded solder contains phenolic hydroxyl compound selected from the group consisting of quercetin, myricetin, anthocyanidin, pro-anthocyanidin, caffeic acid, chlorogenic acid, protocatechuic acid, and ferulic acid. The solder paste contains this flux for joining unleaded solder and unleaded solder powder. A tin-zinc alloy solder powder is applicable for unleaded solder powder. COPYRIGHT: (C)2005,JPO&NCIPI
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