| 摘要 |
PROBLEM TO BE SOLVED: To provide a base material for plating whose adhesion to a plating material can suitably be regulated in accordance with use, and, particularly suitable to use for electronic components in the fields of a semiconductor and a printed circuit board. SOLUTION: In the base material for plating in which a dry film formed layer is formed on the surface of a metal base material with a ten-point mean roughness Rz of≤3.5μm, the arithmetic mean roughness Ra in the micro-region of 2μm×2μm in the dry film formed layer is controlled to 17 to 100 nm. Preferably, at least the surface layer of the dry film formed layer has a columnar structure grown in a direction of≥15 degrees to the direction vertical to the surface of the metal base material. COPYRIGHT: (C)2005,JPO&NCIPI
|
