| 摘要 |
PROBLEM TO BE SOLVED: To provide an etching method and an etching liquid by which a high insulation resistance value can be obtained without causing a short-circuit even in fine wiring in an etching treatment of a two-layer plated board using a polyimide film. SOLUTION: In the two-layer plated board, a thin sputtering film 2 of an Ni-Cr alloy is applied for improving the adhesion between a polyimide film 1 and copper layers 3 and 4 and preventing migration. In the etching method for the two-layer plated board, after etching treatment with a ferric chloride solution or hydrochloric acid-containing cupric chloride solution, treatment is performed by using one or more kinds selected from a hydrochloric acid-containing acidic etching liquid and potassium ferricyanide or permanganate-containing etching liquid, so that the remaining 2' of the etching of the Ni-Cr alloy is dissolved without the side etching and damage to the copper layers. Thus, the fine wiring having the high insulation resistance without causing the short-circuit can be obtained. COPYRIGHT: (C)2005,JPO&NCIPI
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