| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a packaging substrate capable of broadly applying a stacking layer structure with a low cost. <P>SOLUTION: A method of manufacturing the packaging substrate made by laminating and packaging a primary electronic part 11 and a secondary electronic part 12 forming a solder bump on each lower surface, on a substrate 3 in a plurality of steps, comprises the steps of: loading the primary electronic part 11 on the substrate 3 after supplying solder; loading a solder bump 18 of the secondary electronic part 12 on an electrode 17 formed at a top face of the primary electronic part 11; and solder-bonding the secondary electronic part 12 to the primary electronic part 11 while heating the substrate 3 in a reflow process and solder-bonding the primary electronic part 11 to the substrate 3. Thereby, the stacking layer structure is applicable to wide range types of electronic parts by low cost. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
