| 摘要 |
PROBLEM TO BE SOLVED: To efficiently apply paste having stable quality. SOLUTION: In a paste application method for applying, in dot form, paste for chip bonding at plural application points within the application area of a lead frame, the application pattern including the application coordinate data showing the position of each of plural application points and the data on quantity of application to decide the quantity of application at each application point is stored in a pattern storage 33 in advance, and at paste application, the data on these application patterns are read in with a data processor 34, and the shifting table consisting of XYZ axes for relatively shifting the discharge port of an application nozzle to the lead frame is controlled, based on the data on application coordinates and the data on nozzle height, and also a dispenser for discharging the paste from the nozzle is controlled, based on the data on the quantity of application.
|
