| 摘要 |
The present invention provides a socket capable of attaching an IC chip in such a manner that a rear face of the IC chip faces a detector side. By fitting the shape of a package lead (10) into the shape of a positioning structure (6), a package (9) is positioned at and housed in a predetermined portion inside a housing part (2). The package (9) is housed in such a manner that a rear face (9b) thereof faces upwardly. The package lead (10) is pressed by one end (3a1) of a top portion (3a) of a socket lead (3), and is also sandwiched between the socket lead (3) and a upper face of a protrusion (6a) of the positioning structure (6) in the vertical direction. As a result, the socket lead (3) and package lead (10) are securely brought into contact with each other, and the package (9) and a socket base (1) are mutually fixed.
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