METHOD FOR FABRICATING SEMICONDUCTOR DEVICE TO MAINTAIN AIRTIGHTNESS OF SPACE FORMED BY SEALING MEMBER AND SUBSTRATE

摘要

PURPOSE: A method for fabricating a semiconductor device is provided to maintain airtightness of a space formed by a sealing member and a substrate by preventing a bonding position between the sealing member and the substrate from being damaged. CONSTITUTION: A sealing member is bonded to a substrate(12) on which a semiconductor device is mounted to seal the semiconductor device. An opening is formed in the sealing member. The sealing member having the opening is bonded to the substrate. The opening is closed to seal the semiconductor device after the semiconductor device, the substrate and the sealing member are heated.