TAILORED INTERCONNECT MODULE FOR REDUCING NUMBER OF NETS AND MINIMIZING TOTAL NUMBER OF NODES CONNECTED TO EXTERNAL PINS

摘要

PURPOSE: A tailored interconnect module is provided to increase a production yield by reducing the number of nets to minimize the total number of nodes connected to external pins. CONSTITUTION: A package is formed with a plurality of interface pins(IPI-1 to IPI-N). A plurality of integrated circuit devices(11') are installed in the inside of the package. Each of the integrated circuit devices includes a plurality of interface ports(IPO). At least one of the interface ports is connected to another one of the integrated circuit devices. At least one of the integrated circuit devices includes the interface port connected to the interface pin. At least one of the integrated circuit devices is packaged by a chip scale package.