发明名称 METHOD FOR REMOTELY MEASURING TEMPERATURE OF HEATED PART IN CIRCUIT FORMED ON SYSTEM BOARD
摘要 PURPOSE: A method for remotely measuring a temperature of a heated part in a circuit formed on a system board is provided to display temperature data by making a remote temperature measurer installed to the outside read the temperature detected in a thermal sensor installed to the heated part. CONSTITUTION: Thermal sensor circuits(51-53) detect the temperature by installing to the severely heated part in the system board. The remote temperature measurer(60) selects the temperature data detected from the thermal sensor circuits and converting it into a temperature value. An interface transfers the temperature data output from the thermal sensor circuit to the remote temperature measurer by connecting the thermal sensor circuit and the remote temperature measurer. The thermal sensor includes a PN junction detecting a current change depending on a temperature change and an ADC(Analog Digital Converter) digitalizing a current value.
申请公布号 KR20050007769(A) 申请公布日期 2005.01.21
申请号 KR20030047367 申请日期 2003.07.11
申请人 LG ELECTRONICS INC. 发明人 LEE, JANG WON
分类号 G06Q50/00;(IPC1-7):G06F19/00 主分类号 G06Q50/00
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