| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor substrate for suppressing influence on a slice substrate and preventing damages by the falling of an ingot without inviting the decline of machinability even when slurry is used repeatedly for two or more times. SOLUTION: In the manufacturing method of the semiconductor substrate for adhering the ingot 3 composed of a semiconductor material to a support member 9, mounting the support member 9 on a work plate 4, then slicing the ingot 3 and forming a plurality of wafers, the support member 9 is composed of a glass material and a buffer material 12 is interposed between the support member 9 and the work plate 4. COPYRIGHT: (C)2005,JPO&NCIPI
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