| 摘要 |
The invention relates to a component for a printed circuit board (32) comprising a housing (10) on which at least one peg (28) is formed for engaging inside a hole (30) of the printed circuit board (32). This peg (28) has at least one detent lug (52) that projects in a radial direction with regard to the peg (28) beyond the outer periphery thereof. The detent lug (52) is placed and formed on the peg (28) in such a manner that the outer periphery of the peg (28) is smaller in the area of the detent lug (52) than the diameter of the hole (30) in the printed circuit board (32). The outer periphery of the section of the peg (28) projecting into the hole (30) in the printed circuit board (32) is formed in such a manner that, between the outer periphery of this section and the inner wall of the hole (30) in the printed circuit board (32), a space having a capillarity for solder is formed over at least a portion of the outer periphery, whereby during a soldering process, solder (50) located on the surface of the printed circuit board (32) enters, by means of capillary action, the space while filling the same. |
