| 摘要 |
PROBLEM TO BE SOLVED: To provide a device and a method for manufacturing semiconductor element by which the occurrence of a cleavage splitting mistakes can be reduced at the time of performing cleavage splitting on a semiconductor element after a marking scratch is formed on a semiconductor wafer by using a scriber. SOLUTION: As a movable base 4 moves in the direction A, a cam 5 rotates in the direction C, and an arm 6 moves in the direction D synchronizing with the rotation of the cam 5. Then the scriber 3 attached to the front end of the arm 6 moves along the track E and forms a linear scribed scratch on the wafer 1. Immediately after the marking scratch is formed on the wafer 1, the width of the marking scratch is read by means of a binarized recognizing device 7 which works as a detecting section through a camera and image processor provided above the scriber 3. The data value of the read width of the marking scratch is fetched in a personal computer. A control unit provided in the personal computer compares the fetched data value of the width of the marking scratch with a preset value. COPYRIGHT: (C)2005,JPO&NCIPI |
